منابع مشابه
Ceramics Bonding Using Solder Glass Frit
Ceramics bonding is becoming an important technology and has found wide applications in different engineering and electronic industries. In this paper, furnace bonding of ceramics using solder glass frit was investigated with emphasis on the effects of surface treatment and bonding conditions on bonding strength. Alumina (Al2O3) sheet and SCHOTT solder glass G017-393 were used as the base and b...
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Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium a...
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Wafer bonding has been widely used for forming vacuum and hermetic packages for MEMS devices. Several techniques, including anodic silicon-glass, silicon-silicon fusion, metal compression, glass frit, eutectic, and solder bonding have been attempted and some have been demonstrated successfully. Solders have some advantages that make them an interesting area of research for wafer bonding. They o...
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The crystallization of 40Fe2O3-60P2O5, 10ZnO-30Fe2O3-60P2O5 and (43.3−x)PbO–(13.7+x)Fe2O3–43P2O5, (0 < x < 30), glasses and glassceramic have been investigated. The structural evolution of glasses during heat treatment at various temperatures and the tendency for crystallization for series of glasses with modified composition are characterized by a dendrite-like phase separation in the early st...
متن کاملResearch on Glass Frit Deposition Based on the Electrospray Process
In this paper, the electrospray technology is used to easily deposit the glass frit into patterns at a micro-scale level. First, far-field electrospray process was carried out with a mixture of glass frit in the presence of ethanol. A uniform, smooth, and dense glass frit film was obtained, verifying that the electrospray technology was feasible. Then, the distance between the nozzle and the su...
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ژورنال
عنوان ژورنال: Journal of Electronic Materials
سال: 2004
ISSN: 0361-5235,1543-186X
DOI: 10.1007/s11664-004-0093-y